Take the powder of tin, silver and copper solder as the basis to make solder paste and simulate soldering. 以自制的锡银铜系焊粉为基础制备焊膏并做焊接模拟。
Experimental results show that nonohmic contact between silver electrode and ceramic, and pores on the surface of electrode when welding flux permeates into the electrode, are two key factors for the performance of soldering. 通过对比实验发现,影响焊接性能的主要原因是银电极与元件之间形成的非欧姆接触以及助焊剂渗入烧结电极时,电极表面产生的气孔。